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MAX4691EGE+
Maxim Integrated Products
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$4.1897 | Yes | Yes | Transferred | 5 V | YES | -5 V | 25 Ω | 2 Ω | 90 ns | 60 ns | 20 mA | SINGLE-ENDED MULTIPLEXER | BICMOS | -5.5 V | -2 V | 8 | 1 | 82 dB | 1 µA | 5.5 V | 2 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, ROHS COMPLIANT, QFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4691EGE+
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | YES | -5 V | 25 Ω | 2 Ω | 90 ns | 60 ns | 20 mA | SINGLE-ENDED MULTIPLEXER | BICMOS | -5.5 V | -2 V | 8 | 1 | 82 dB | 1 µA | 5.5 V | 2 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | ANALOG DEVICES INC | 16-LFCSP-4X4X0.85 | 4 X 4 MM, ROHS COMPLIANT, QFN-16 | 16 | compliant | 16-LFCSP-4X4X0.85 | 2001-01-03 | Analog Devices | |||||
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MAX4691EGE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 5 V | YES | -5 V | 25 Ω | 2 Ω | 90 ns | 60 ns | SINGLE-ENDED MULTIPLEXER | BICMOS | -5.5 V | -2 V | 8 | 1 | 82 dB | 5.5 V | 2 V | INDUSTRIAL | S-XQCC-N16 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, ROHS COMPLIANT, QFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||||||
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MAX4691EGE-T
Maxim Integrated Products
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Check for Price | No | Obsolete | 5 V | YES | -5 V | 25 Ω | 2 Ω | 80 ns | 50 ns | 20 mA | SINGLE-ENDED MULTIPLEXER | CMOS | -5.5 V | -4.5 V | 8 | 1 | 82 dB | 1 µA | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.85 MM HEIGHT, MO-220, QFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX4691EGE+T
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | YES | -5 V | 25 Ω | 2 Ω | 90 ns | 60 ns | SINGLE-ENDED MULTIPLEXER | BICMOS | -5.5 V | -2 V | 8 | 1 | 82 dB | 5.5 V | 2 V | INDUSTRIAL | S-XQCC-N16 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | ANALOG DEVICES INC | 16-LFCSP-4X4X0.85 | 4 X 4 MM, ROHS COMPLIANT, QFN-16 | 16 | compliant | 16-LFCSP-4X4X0.85 | 2001-01-03 | Analog Devices | ||||||||||
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MAX4691EGE
Maxim Integrated Products
|
Check for Price | No | Obsolete | 5 V | YES | -5 V | 25 Ω | 2 Ω | 90 ns | 60 ns | 20 mA | SINGLE-ENDED MULTIPLEXER | BICMOS | -5.5 V | -2 V | 8 | 1 | 82 dB | 1 µA | 5.5 V | 2 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 900 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, QFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 |