Findchips: Parametric Search Results for max32631icq


Select Parts		Part Number

		MAX32631ICQ+ Analog Devices Inc
		MAX32631ICQ+T Maxim Integrated Products
		MAX32631ICQ+ Maxim Integrated Products

				Most Relevant								Technical												Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	DAC Channels	DMA Channels	Has ADC	On Chip Program ROM Width	PWM Channels	ROM Programmability	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	Date Of Intro	Samacsys Manufacturer	ECCN Code	HTS Code

$13.0374

Yes

Active

96 MHz

2097152

524288

32 kHz

YES

1.2 V

MICROCONTROLLER, RISC

CMOS

ALSO REQUIRES 1.8V NOM SUPPLY

YES

FLASH

1.26 V

1.2 V

OTHER

S-PQFP-G100

85 °C

-20 °C

260

100

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.2 mm

14 mm

ANALOG DEVICES INC

100-TQFP_EP-14X14X1.0

TQFP-100

100

100-TQFP_EP-14X14X1.0

compliant

2016-04-22

Analog Devices

Check for Price

Yes

Transferred

96 MHz

48 MHz

YES

1.2 V

MICROCONTROLLER, RISC

YES

1.26 V

1.14 V

NOT SPECIFIED

100

TQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

GULL WING

500 µm

QUAD

14 mm

MAXIM INTEGRATED PRODUCTS INC

TQFP,

compliant

3A991.A.2

8542.31.00.01

Check for Price

Yes

Transferred

96 MHz

2097152

524288

32 kHz

YES

1.2 V

MICROCONTROLLER, RISC

CMOS

ALSO REQUIRES 1.8V NOM SUPPLY

YES

FLASH

1.26 V

1.14 V

OTHER

S-PQFP-G100

85 °C

-20 °C

260

100

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

1.2 mm

14 mm

MAXIM INTEGRATED PRODUCTS INC

TQFP-100

compliant

2018-03-30

8542.31.00.01

Compare

MAX32631ICQ+

Analog Devices Inc

$13.0374

Yes

Active

96 MHz

2097152

524288

32 kHz

YES

1.2 V

MICROCONTROLLER, RISC

CMOS

ALSO REQUIRES 1.8V NOM SUPPLY

YES

FLASH

1.26 V

1.2 V

OTHER

S-PQFP-G100

85 °C

-20 °C

260

100

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.2 mm

14 mm

ANALOG DEVICES INC

100-TQFP_EP-14X14X1.0

TQFP-100

100

100-TQFP_EP-14X14X1.0

compliant

2016-04-22

Analog Devices

MAX32631ICQ+T

Maxim Integrated Products

Check for Price

Yes

Transferred

96 MHz

48 MHz

YES

1.2 V

MICROCONTROLLER, RISC

YES

1.26 V

1.14 V

NOT SPECIFIED

100

TQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

GULL WING

500 µm

QUAD

14 mm

MAXIM INTEGRATED PRODUCTS INC

TQFP,

compliant

3A991.A.2

8542.31.00.01

MAX32631ICQ+

Maxim Integrated Products

Check for Price

Yes

Transferred

96 MHz

2097152

524288

32 kHz

YES

1.2 V

MICROCONTROLLER, RISC

CMOS

ALSO REQUIRES 1.8V NOM SUPPLY

YES

FLASH

1.26 V

1.14 V

OTHER

S-PQFP-G100

85 °C

-20 °C

260

100

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

1.2 mm

14 mm

MAXIM INTEGRATED PRODUCTS INC

TQFP-100

compliant

2018-03-30

8542.31.00.01

Parametric results for: max32631icq under Microcontrollers