Parametric results for: max3100etg+ under Serial IO/Communication Controllers
Filter Your Search
1 - 4 of 4 results
|
Select parts from the table below to compare.
Compare
Compare
|
MAX3100ETG+
Maxim Integrated Products
|
$5.3400 | Yes | Yes | Transferred | 0.028125 MBps | 3.6864 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | BICMOS | NO | ASYNC, BIT | YES | 1 | 5.5 V | 2.7 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | ROHS COMPLIANT, TQFN-24 | 24 | compliant | EAR99 | 8542.39.00.01 | ||||||
|
|
MAX3100ETG+T
Analog Devices Inc
|
Check for Price | Yes | Active | IRDA; MICROWIRE; RS232; RS485; SPI | 0.028125 MBps | 4 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | BICMOS | NO | ASYNC, BIT | YES | 1 | 5.5 V | 2.7 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | 24-LFCSP-4X4X0.75 | 24 | 24-LFCSP-4X4X0.75 | 1997-07-07 | Analog Devices | ||||||||||
|
|
MAX3100ETG+T
Maxim Integrated Products
|
Check for Price | Yes | Transferred | IRDA; MICROWIRE; RS232; RS485; SPI | 0.028125 MBps | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | BICMOS | NO | ASYNC, BIT | YES | 1 | 5.5 V | 2.7 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | EAR99 | 8542.39.00.01 | |||||||||||
|
|
MAX3100ETG+
Analog Devices Inc
|
Check for Price | Yes | Active | 0.028125 MBps | 3.6864 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | BICMOS | NO | ASYNC, BIT | YES | 1 | 5.5 V | 2.7 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | ANALOG DEVICES INC | 24-LFCSP-4X4X0.75 | ROHS COMPLIANT, TQFN-24 | 24 | compliant | 24-LFCSP-4X4X0.75 | 1997-07-07 | Analog Devices |