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Parametric » Power Circuits » Power Management Circuits

Parametric results for: max20353bewn+ under Power Management Circuits

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Select Parts		Part Number

		MAX20353BEWN+T Analog Devices Inc
		MAX20353BEWN+ Analog Devices Inc
		MAX20353BEWN+T Maxim Integrated Products

			Most Relevant							Technical			Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Pin Count	Manufacturer Package Code	Reach Compliance Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+2.4V

5

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

BICMOS

R-XBGA-B56

1

85 °C

-40 °C

260

30

56

UNSPECIFIED

VFBGA

BGA56,7X8,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

3.678 mm

4.178 mm

690 µm

ANALOG DEVICES INC

56-WLCSP-N/A

56

56-WLCSP-N/A

compliant

2020-04-09

Analog Devices

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+2.4V

5

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

BICMOS

R-XBGA-B56

1

85 °C

-40 °C

260

30

56

UNSPECIFIED

VFBGA

BGA56,7X8,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

3.678 mm

4.178 mm

690 µm

56-WLCSP-N/A

56

56-WLCSP-N/A

2020-04-09

Analog Devices

Check for Price

Yes

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant

Compare

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+2.4V

5

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

BICMOS

R-XBGA-B56

1

85 °C

-40 °C

260

30

56

UNSPECIFIED

VFBGA

BGA56,7X8,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

3.678 mm

4.178 mm

690 µm

ANALOG DEVICES INC

56-WLCSP-N/A

56

56-WLCSP-N/A

compliant

2020-04-09

Analog Devices

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

+2.4V

5

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

BICMOS

R-XBGA-B56

1

85 °C

-40 °C

260

30

56

UNSPECIFIED

VFBGA

BGA56,7X8,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

3.678 mm

4.178 mm

690 µm

56-WLCSP-N/A

56

56-WLCSP-N/A

2020-04-09

Analog Devices

Maxim Integrated Products

Check for Price

Yes

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

compliant