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Parametric » Signal Circuits » Multiplexers or Switches

Parametric results for: max14689ewl+t under Multiplexers or Switches

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX14689EWL+T Maxim Integrated Products
		MAX14689EWL+T Macronix International Co Ltd
		MAX14689EWL+T Analog Devices Inc

				Most Relevant			Technical						Compliance			Operating Conditions					Physical										Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	On-state Resistance-Max (Ron)	Switch-on Time-Max	Analog IC - Other Type	Technology	Number of Functions	Output	Switching	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Part Package Code	Pin Count	Manufacturer Package Code	Samacsys Manufacturer

Yes

Yes

Transferred

YES

550 mΩ

250 µs

DPDT

BICMOS

1

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

Not Qualified

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

FBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

DPDT

NOT SPECIFIED

NOT SPECIFIED

MACRONIX INTERNATIONAL CO LTD

compliant

8542.39.00.01

2018-10-12

Check for Price

Yes

Active

YES

550 mΩ

250 µs

DPDT

BICMOS

1

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

Not Qualified

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

FBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

ANALOG DEVICES INC

compliant

2013-09-27

9-WLCSP-N/A

9

9-WLCSP-N/A

Analog Devices

Compare

Maxim Integrated Products

Yes

Yes

Transferred

YES

550 mΩ

250 µs

DPDT

BICMOS

1

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

Not Qualified

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

FBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

Macronix International Co Ltd

Check for Price

Yes

Active

DPDT

NOT SPECIFIED

NOT SPECIFIED

MACRONIX INTERNATIONAL CO LTD

compliant

8542.39.00.01

2018-10-12

Analog Devices Inc

Check for Price

Yes

Active

YES

550 mΩ

250 µs

DPDT

BICMOS

1

SEPARATE OUTPUT

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

Not Qualified

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

FBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

ANALOG DEVICES INC

compliant

2013-09-27

9-WLCSP-N/A

9

9-WLCSP-N/A

Analog Devices