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MAX1122BEGK-D
Maxim Integrated Products
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MAX1122BEGK-TD
Maxim Integrated Products
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MAX1122EGK
Maxim Integrated Products
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MAX1122EGK-T
Maxim Integrated Products
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MAX1122BEGK+D
Maxim Integrated Products
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MAX1122BEGK+TD
Maxim Integrated Products
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MAX1122EGK+TD
Maxim Integrated Products
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MAX1122EGK-TD
Maxim Integrated Products
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MAX1122EGK+D
Maxim Integrated Products
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MAX1122EGK-D
Maxim Integrated Products
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom |
Analog Input Voltage-Max
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Number of Analog In Channels
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Linearity Error-Max (EL)
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Number of Bits | Sample Rate |
Surface Mount
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Converter Type
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Analog Input Voltage-Min
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Number of Functions |
Output Bit Code
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Sample and Hold / Track and Hold
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Temperature Grade
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Output Format
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Seated Height-Max
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Length
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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HTS Code
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ECCN Code
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No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 68 | compliant | 8542.39.00.01 | |||||
No | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | |||
No | No | Transferred | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC68,.4SQ,20 | 68 | not_compliant | 8542.39.00.01 | ||||
Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 68 | unknown | 8542.39.00.01 | |||||||
Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | ||||
Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | |
Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | |
No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 8542.39.00.01 | |||||
Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | |
No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 8542.39.00.01 |
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MAX1122BEGK-D
Maxim Integrated Products
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Check for Price Buy | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 68 | compliant | 8542.39.00.01 | ||||||
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MAX1122BEGK-TD
Maxim Integrated Products
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Check for Price Buy | No | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | ||||
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MAX1122EGK
Maxim Integrated Products
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Check for Price Buy | No | No | Transferred | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC68,.4SQ,20 | 68 | not_compliant | 8542.39.00.01 | |||||
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MAX1122EGK-T
Maxim Integrated Products
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Check for Price Buy | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 68 | unknown | 8542.39.00.01 | ||||||||
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MAX1122BEGK+D
Maxim Integrated Products
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Check for Price Buy | Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | |||||
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MAX1122BEGK+TD
Maxim Integrated Products
|
Check for Price Buy | Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | ||
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MAX1122EGK+TD
Maxim Integrated Products
|
Check for Price Buy | Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | ||
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MAX1122EGK-TD
Maxim Integrated Products
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Check for Price Buy | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 8542.39.00.01 | ||||||
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MAX1122EGK+D
Maxim Integrated Products
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Check for Price Buy | Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 8542.39.00.01 | 3A991.C.1 | ||
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MAX1122EGK-D
Maxim Integrated Products
|
Check for Price Buy | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 8542.39.00.01 |