Parametric results for: m3851020602bva under OTP ROMs

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Manufacturer Part Number: m3851020602bva
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M38510/20602BVA
NXP Semiconductors
Check for Price Obsolete OTP ROM Not Qualified NXP SEMICONDUCTORS , unknown EAR99 8542.32.00.71
M38510/20602BVA
AMD
Check for Price Obsolete OTP ROM Not Qualified ADVANCED MICRO DEVICES INC , unknown EAR99 8542.32.00.71
M38510/20602BVA
Teledyne e2v
Check for Price Obsolete 4.096 kbit 4 1KX4 5 V 85 ns OTP ROM COMMON 1 1000 1.024 k ASYNCHRONOUS PARALLEL 140 µA 5.5 V 4.5 V BIPOLAR MILITARY R-XDIP-T18 Qualified e0 125 °C -55 °C MIL-M-38510 Class B 18 UNSPECIFIED DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE DUAL TELEDYNE E2V (UK) LTD DIP, DIP18,.3 compliant EAR99 8542.32.00.71
M38510/20602BVA
Lansdale Semiconductor Inc
Check for Price Active 2.0972 Mbit 16 128KX16 5 V 70 ns OTP ROM 1 128000 1.024 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V TTL MILITARY R-XDIP-T18 Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL LANSDALE SEMICONDUCTOR INC compliant EAR99 8542.32.00.71
M38510/20602BVA
Philips Semiconductors
Check for Price No Transferred 4.096 kbit 4 1KX4 5 V 85 ns OTP ROM 1000 1.024 k 140 µA TTL MILITARY R-XDIP-T18 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) - hot dipped THROUGH-HOLE 2.54 mm DUAL PHILIPS SEMICONDUCTORS unknown EAR99 8542.32.00.71
M38510/20602BVA
QP Semiconductor
Check for Price Transferred OTP ROM Not Qualified e0 TIN LEAD QP SEMICONDUCTOR INC , unknown EAR99 8542.32.00.71