Findchips: Parametric Search Results for m36w832t

Parametric results for: m36w832t under Other Memory ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		M36W832TE85ZA1S STMicroelectronics
		M36W832TE85ZA1 STMicroelectronics
		M36W832T100ZA6 Numonyx Memory Solutions
		M36W832TE70ZA6S STMicroelectronics
		M36W832TE70ZA1 Numonyx Memory Solutions
		M36W832TE70ZA1S STMicroelectronics
		M36W832TE100ZA6T Numonyx Memory Solutions
		M36W832TE100ZA1T STMicroelectronics
		M36W832T85ZA6 Numonyx Memory Solutions
		M36W832TE85ZA6 STMicroelectronics

			Most Relevant					Technical													Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

100 ns

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.3 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

1 2 3 4 5 Next

Compare

M36W832TE85ZA1S

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

M36W832TE85ZA1

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36W832T100ZA6

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

M36W832TE70ZA6S

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36W832TE70ZA1

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36W832TE70ZA1S

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.6 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

M36W832TE100ZA6T

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36W832TE100ZA1T

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

100 ns

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.3 V

2.7 V

CMOS

COMMERCIAL

R-PBGA-B66

Not Qualified

70 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36W832T85ZA6

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

ALSO CONTAINS 512K X 16 SRAM

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

unknown

EAR99

8542.32.00.71

M36W832TE85ZA6

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

20 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, LFBGA-66

not_compliant

EAR99

8542.32.00.71

1 2 3 4 5 Next