Findchips: Parametric Search Results for m29dw323db70za1


Select Parts		Part Number

		M29DW323DB70ZA1E STMicroelectronics
		M29DW323DB70ZA1E Numonyx Memory Solutions
		M29DW323DB70ZA1T Numonyx Memory Solutions
		M29DW323DB70ZA1F Numonyx Memory Solutions
		M29DW323DB70ZA1 STMicroelectronics
		M29DW323DB70ZA1 Numonyx Memory Solutions
		M29DW323DB70ZA1F STMicroelectronics
		M29DW323DB70ZA1T STMicroelectronics

			Most Relevant						Technical																							Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

TFBGA,

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, TFBGA-63

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

TFBGA,

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, TFBGA-63

not_compliant

EAR99

8542.32.00.51

Compare

M29DW323DB70ZA1E

STMicroelectronics

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

M29DW323DB70ZA1E

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

M29DW323DB70ZA1T

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

TFBGA,

not_compliant

EAR99

8542.32.00.51

M29DW323DB70ZA1F

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

M29DW323DB70ZA1

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, TFBGA-63

not_compliant

EAR99

8542.32.00.51

M29DW323DB70ZA1

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

NUMONYX

BGA

TFBGA,

not_compliant

EAR99

8542.32.00.51

M29DW323DB70ZA1F

STMicroelectronics

Check for Price

Yes

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63

unknown

EAR99

8542.32.00.51

M29DW323DB70ZA1T

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

100 µA

20 µA

3.6 V

2.7 V

CMOS

COMMERCIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

70 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

STMICROELECTRONICS

BGA

7 X 11 MM, 0.80 MM PITCH, TFBGA-63

not_compliant

EAR99

8542.32.00.51

Parametric results for: m29dw323db70za1 under Flash Memories