Findchips: Parametric Search Results for m2725625

Parametric results for: m2725625 under EPROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		M27256-25F1 SGS-Ates Componenti Electronici SPA
		MBM27256-25CV FUJITSU Semiconductor Limited
		MBM27256-25Z-X FUJITSU Limited
		AM27256-25LI AMD
		DM27256-25 LSI Corporation
		M27256-25F6 STMicroelectronics
		MBM27256-25CV FUJITSU Limited
		AM27256-25DEB AMD
		AM27256-25DIB Rochester Electronics LLC
		MBM27256-25X FUJITSU Limited

				Most Relevant					Technical														Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

MOS

COMMERCIAL

R-XDIP-T28

Not Qualified

70 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SGS-ATES COMPONENTI ELECTRONICI S P A

DIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

50 µA

5.25 V

4.75 V

NMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

RECTANGULAR

CHIP CARRIER, WINDOW

YES

NO LEAD

1.27 mm

QUAD

3.3 mm

13.97 mm

11.43 mm

FUJITSU SEMICONDUCTOR AMERICA INC

WQCCN,

unknown

EAR99

8542.32.00.61

Check for Price

Active

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

120 µA

MOS

INDUSTRIAL

R-XDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

FUJITSU LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.71

QFJ

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

70 µA

MOS

MILITARY

R-XDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SEEQ TECHNOLOGY INC

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.71 mm

15.24 mm

STMICROELECTRONICS

WINDOWED, FRIT SEALED, CERAMIC, DIP-28

not_compliant

EAR99

8542.32.00.61

DIP

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

MOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

FUJITSU LTD

QCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

QFJ

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.71

DIP

Check for Price

Contact Manufacturer

262.144 kbit

32KX8

5 V

250 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-GDIP-T28

85 °C

-40 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ROCHESTER ELECTRONICS LLC

DIP,

unknown

EAR99

8542.32.00.61

Check for Price

Active

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

120 µA

MOS

INDUSTRIAL

R-XDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

FUJITSU LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.61

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Compare

M27256-25F1

SGS-Ates Componenti Electronici SPA

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

MOS

COMMERCIAL

R-XDIP-T28

Not Qualified

70 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SGS-ATES COMPONENTI ELECTRONICI S P A

DIP, DIP28,.6

unknown

EAR99

8542.32.00.61

MBM27256-25CV

FUJITSU Semiconductor Limited

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

50 µA

5.25 V

4.75 V

NMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

RECTANGULAR

CHIP CARRIER, WINDOW

YES

NO LEAD

1.27 mm

QUAD

3.3 mm

13.97 mm

11.43 mm

FUJITSU SEMICONDUCTOR AMERICA INC

WQCCN,

unknown

EAR99

8542.32.00.61

MBM27256-25Z-X

FUJITSU Limited

Check for Price

Active

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

120 µA

MOS

INDUSTRIAL

R-XDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

FUJITSU LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.61

AM27256-25LI

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-CQCC-N32

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.71

QFJ

DM27256-25

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

70 µA

MOS

MILITARY

R-XDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SEEQ TECHNOLOGY INC

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

M27256-25F6

STMicroelectronics

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.71 mm

15.24 mm

STMICROELECTRONICS

WINDOWED, FRIT SEALED, CERAMIC, DIP-28

not_compliant

EAR99

8542.32.00.61

DIP

MBM27256-25CV

FUJITSU Limited

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

MOS

COMMERCIAL

R-XQCC-N32

Not Qualified

70 °C

CERAMIC

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

FUJITSU LTD

QCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

QFJ

AM27256-25DEB

AMD

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

250 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

5.5 V

4.5 V

NMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.71

DIP

AM27256-25DIB

Rochester Electronics LLC

Check for Price

Contact Manufacturer

262.144 kbit

32KX8

5 V

250 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

NMOS

INDUSTRIAL

R-GDIP-T28

85 °C

-40 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ROCHESTER ELECTRONICS LLC

DIP,

unknown

EAR99

8542.32.00.61

MBM27256-25X

FUJITSU Limited

Check for Price

Active

262.144 kbit

32KX8

5 V

250 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

120 µA

MOS

INDUSTRIAL

R-XDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

FUJITSU LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.61

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