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LTC2188CUP#PBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 2 V | 2 | 0.0099 % | 16 | 20 MHz | YES | ADC, PROPRIETARY METHOD | -2 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | QFN | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | UP | compliant | 3A991.C.4 | 8542.39.00.01 | |||
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LTC2188CUP#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 1.8 V | 2 V | 2 | 0.0099 % | 16 | 20 MHz | YES | ADC, PROPRIETARY METHOD | -2 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 | 64 | 05-08-1705 | compliant |