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LTC2158CUP-12#PBF
Analog Devices Inc
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Check for Price | No | Yes | Not Recommended | 1.8 V | 1.32 V | 2 | 2.2 % | 12 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | HVQCCN, | 64 | 05-08-1705 | compliant | 8542.39.00.01 | |||||
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LTC2158CUP-12#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 1.32 V | 2 | 2.2 % | 12 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | HVQCCN, LCC64,.35SQ,20 | 64 | UP | compliant | 8542.39.00.01 | QFN | 3A991.C.2 | |||
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LTC2158CUP-12#PBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 1.32 V | 2 | 2.2 % | 12 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | HVQCCN, LCC64,.35SQ,20 | 64 | UP | compliant | 8542.39.00.01 | QFN | 3A991.C.2 | |||
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LTC2158CUP-14#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 1.8 V | 1.32 V | 2 | 0.0458 % | 14 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | HVQCCN, LCC64,.35SQ,20 | 64 | UP | compliant | 8542.39.00.01 | QFN | 3A991.C.3 | |||
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LTC2158CUP-14#PBF
Linear Technology
|
Check for Price | Yes | Transferred | 1.8 V | 1.32 V | 2 | 0.0458 % | 14 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | LINEAR TECHNOLOGY CORP | HVQCCN, LCC64,.35SQ,20 | 64 | UP | compliant | 8542.39.00.01 | QFN | 3A991.C.3 | |||
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LTC2158CUP-12#TRPBF
Analog Devices Inc
|
Check for Price | No | Yes | Not Recommended | 1.8 V | 1.32 V | 2 | 2.2 % | 12 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | HVQCCN, | 64 | 05-08-1705 | compliant | 8542.39.00.01 | |||||
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LTC2158CUP-14#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Not Recommended | 1.8 V | 1.32 V | 2 | 0.0458 % | 14 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | HVQCCN, | 64 | 05-08-1705 | compliant | 8542.39.00.01 | 3A001.A.5.A.4 | ||||
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LTC2158CUP-14#PBF
Analog Devices Inc
|
Check for Price | No | Yes | Not Recommended | 1.8 V | 1.32 V | 2 | 0.0458 % | 14 | 310 MHz | YES | ADC, PROPRIETARY METHOD | -1.32 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N64 | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 9 mm | ANALOG DEVICES INC | HVQCCN, | 64 | 05-08-1705 | compliant | 8542.39.00.01 | 3A001.A.5.A.4 |