Parametric results for: ltc2158c under Analog to Digital Converters

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Manufacturer Part Number: ltc2158c
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LTC2158CUP-12#PBF
Analog Devices Inc
Check for Price No Yes Not Recommended 1.8 V 1.32 V 2 2.2 % 12 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm ANALOG DEVICES INC HVQCCN, 64 05-08-1705 compliant 8542.39.00.01
LTC2158CUP-12#TRPBF
Linear Technology
Check for Price Yes Transferred 1.8 V 1.32 V 2 2.2 % 12 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 Not Qualified e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm LINEAR TECHNOLOGY CORP HVQCCN, LCC64,.35SQ,20 64 UP compliant 8542.39.00.01 QFN 3A991.C.2
LTC2158CUP-12#PBF
Linear Technology
Check for Price Yes Transferred 1.8 V 1.32 V 2 2.2 % 12 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 Not Qualified e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm LINEAR TECHNOLOGY CORP HVQCCN, LCC64,.35SQ,20 64 UP compliant 8542.39.00.01 QFN 3A991.C.2
LTC2158CUP-14#TRPBF
Linear Technology
Check for Price Yes Transferred 1.8 V 1.32 V 2 0.0458 % 14 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 Not Qualified e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm LINEAR TECHNOLOGY CORP HVQCCN, LCC64,.35SQ,20 64 UP compliant 8542.39.00.01 QFN 3A991.C.3
LTC2158CUP-14#PBF
Linear Technology
Check for Price Yes Transferred 1.8 V 1.32 V 2 0.0458 % 14 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 Not Qualified e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm LINEAR TECHNOLOGY CORP HVQCCN, LCC64,.35SQ,20 64 UP compliant 8542.39.00.01 QFN 3A991.C.3
LTC2158CUP-12#TRPBF
Analog Devices Inc
Check for Price No Yes Not Recommended 1.8 V 1.32 V 2 2.2 % 12 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm ANALOG DEVICES INC HVQCCN, 64 05-08-1705 compliant 8542.39.00.01
LTC2158CUP-14#TRPBF
Analog Devices Inc
Check for Price No Yes Not Recommended 1.8 V 1.32 V 2 0.0458 % 14 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm ANALOG DEVICES INC HVQCCN, 64 05-08-1705 compliant 8542.39.00.01 3A001.A.5.A.4
LTC2158CUP-14#PBF
Analog Devices Inc
Check for Price No Yes Not Recommended 1.8 V 1.32 V 2 0.0458 % 14 310 MHz YES ADC, PROPRIETARY METHOD -1.32 V 1 OFFSET BINARY, 2'S COMPLEMENT BINARY SAMPLE CMOS COMMERCIAL PARALLEL, WORD S-PQCC-N64 e3 1 70 °C 260 30 64 PLASTIC/EPOXY HVQCCN LCC64,.35SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 9 mm 800 µm 9 mm ANALOG DEVICES INC HVQCCN, 64 05-08-1705 compliant 8542.39.00.01 3A001.A.5.A.4