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LPC1113FHN33/302,5
NXP Semiconductors
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$2.9457 | Yes | Active | 32 | 50 MHz | 24576 | 8192 | CORTEX-M0 | 25 MHz | 28 | YES | 3.3 V | MICROCONTROLLER, RISC | CMOS | NO | NO | NO | YES | 8 | NO | FLASH | 3.6 V | 3.3 V | INDUSTRIAL | S-PQCC-N33 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 33 | PLASTIC/EPOXY | HVQCCN | LCC32,.27SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 650 µm | QUAD | 7 mm | 7 mm | NXP SEMICONDUCTORS | QFN | 32 | SOT865-3 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
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LPC1113FHN33/302,551
NXP Semiconductors
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Check for Price | Active | 32 | 50 MHz | 24576 | 8192 | CORTEX-M0 | 25 MHz | 28 | 5 | YES | 3.3 V | MICROCONTROLLER, RISC | CMOS | NO | NO | NO | FIXED POINT | YES | NO | YES | 1 | 8 | 8 | NO | FLASH | 100 mA | 3.6 V | 3.3 V | S-PQCC-N33 | 85 °C | -40 °C | 33 | PLASTIC/EPOXY | HVQCCN | LCC32,.27SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 650 µm | QUAD | 1 mm | 7 mm | 7 mm | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | , | |||||||||||||||
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LPC1113FHN33/302:5
NXP Semiconductors
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Check for Price | Yes | Active | 32 | 50 MHz | 25 MHz | 28 | YES | 3.3 V | MICROCONTROLLER, RISC | NO | YES | NO | 3.6 V | 1.8 V | e4 | 3 | 260 | 30 | 32 | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 650 µm | QUAD | 7 mm | 7 mm | NXP SEMICONDUCTORS | QFN | 32 | SOT865-3 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | HVQCCN, |