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Parametric results for: lpc1112fhn33101 under Microcontrollers

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Manufacturer Part Number: lpc1112fhn33101
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LPC1112FHN33/101,551
 NXP Semiconductors 		$1.2879 Active 32 50 MHz 16384 2048 CORTEX-M0 25 MHz 28 5 YES 3.3 V MICROCONTROLLER, RISC CMOS NO NO NO FIXED POINT YES NO YES 1 8 8 NO FLASH 100 mA 3.6 V 3.3 V S-PQCC-N32 85 °C -40 °C 33 PLASTIC/EPOXY HVQCCN LCC32,.27SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 650 µm QUAD 1 mm 7 mm 7 mm NXP SEMICONDUCTORS , unknown 8542.31.00.01
LPC1112FHN33/101
 NXP Semiconductors 		$2.2996 Yes Active 32 50 MHz 25 MHz 28 YES 3.3 V MICROCONTROLLER, RISC CMOS NO NO YES NO FLASH 3.6 V 1.8 V INDUSTRIAL S-PQCC-N33 Not Qualified e4 3 85 °C -40 °C 260 30 33 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD NO LEAD 650 µm QUAD 1 mm 7 mm 7 mm NXP SEMICONDUCTORS 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33 compliant 8542.31.00.01 QFN 33 3A991.A.2
LPC1112FHN33/101,5
 NXP Semiconductors 		Check for Price Yes Active 32 50 MHz 16384 2048 CORTEX-M0 25 MHz 28 YES 3.3 V MICROCONTROLLER, RISC CMOS NO NO NO YES 8 NO FLASH 3.6 V 3.3 V INDUSTRIAL S-PQCC-N32 Not Qualified e4 3 85 °C -40 °C 260 30 33 PLASTIC/EPOXY HVQCCN LCC32,.27SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 650 µm QUAD 7 mm 7 mm NXP SEMICONDUCTORS compliant 8542.31.00.01 QFN 32 3A991.A.2 SOT865-3 NXP