Parametric results for: ks092-210gg under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 3

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1.0 inch 3

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0.155 inch 4

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1.0 inch 3

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10X10 3 RECTANGLE 1

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AU ON NI 2 GOLD OVER NICKEL 2

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Gold (Au) - with Nickel (Ni) barrier 4

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Contact Material (3)

BE-CU 2 BERYLLIUM COPPER 1 BERYLLIUM COPPER/COPPER ALLOY 1

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RND PIN-SKT 4

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IC SOCKET 4

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DIP92 1 PGA92 3

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POLYAMIDE 3 POLYIMIDE 1

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e4 4

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Manufacturer (1)

Advanced Interconnections Corp 4

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0.1 inch 4

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STRAIGHT 4

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Number of Contacts (1)

92 4

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400.0 °C 3

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-269.0 °C 3

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RECTANGULAR 4

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100 µm 4

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Active 1 Obsolete 3

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Yes 1

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Yes 4

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Terminal Pitch (1)

2.54 mm 4

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SOLDER 4

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