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Manufacturer Part Number: km41464a
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KM41464AP-15
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 150 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 65 µA MOS COMMERCIAL R-PDIP-T18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL SAMSUNG SEMICONDUCTOR INC DIP, DIP18,.3 unknown EAR99 8542.32.00.02
KM41464AZ-10
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 100 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE MOS COMMERCIAL R-PZIP-T20 Not Qualified e0 3 70 °C 20 PLASTIC/EPOXY ZIP ZIP20,.1 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 1.27 mm ZIG-ZAG SAMSUNG SEMICONDUCTOR INC ZIP, ZIP20,.1 unknown EAR99 8542.32.00.02
KM41464AZ-15
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 150 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 65 µA MOS COMMERCIAL R-PZIP-T20 Not Qualified e0 3 70 °C 20 PLASTIC/EPOXY ZIP ZIP20,.1 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 1.27 mm ZIG-ZAG SAMSUNG SEMICONDUCTOR INC ZIP, ZIP20,.1 unknown EAR99 8542.32.00.02
KM41464AP-10
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 100 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE MOS COMMERCIAL R-PDIP-T18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL SAMSUNG SEMICONDUCTOR INC DIP, DIP18,.3 unknown EAR99 8542.32.00.02
KM41464AJ-12
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 120 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 75 µA MOS COMMERCIAL R-PQCC-J18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY QCCJ LDCC18,.33X.53 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD SAMSUNG SEMICONDUCTOR INC QCCJ, LDCC18,.33X.53 unknown EAR99 8542.32.00.02
KM41464AJ-10
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 100 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE MOS COMMERCIAL R-PQCC-J18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY QCCJ LDCC18,.33X.53 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD SAMSUNG SEMICONDUCTOR INC QCCJ, LDCC18,.33X.53 unknown EAR99 8542.32.00.02
KM41464AP-12
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 120 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 75 µA MOS COMMERCIAL R-PDIP-T18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL SAMSUNG SEMICONDUCTOR INC DIP-18 unknown EAR99 8542.32.00.02
KM41464AJ-15
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 150 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 65 µA MOS COMMERCIAL R-PQCC-J18 Not Qualified e0 3 70 °C 18 PLASTIC/EPOXY QCCJ LDCC18,.33X.53 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD SAMSUNG SEMICONDUCTOR INC QCCJ, LDCC18,.33X.53 unknown EAR99 8542.32.00.02
KM41464AZ-12
 Samsung Semiconductor 		Check for Price No No Obsolete 262.144 kbit 4 64KX4 5 V 120 ns 256 PAGE MODE DRAM COMMON 64000 65.536 k 3-STATE 75 µA MOS COMMERCIAL R-PZIP-T20 Not Qualified e0 3 70 °C 20 PLASTIC/EPOXY ZIP ZIP20,.1 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 1.27 mm ZIG-ZAG SAMSUNG SEMICONDUCTOR INC ZIP, ZIP20,.1 unknown EAR99 8542.32.00.02