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KAD5514P-21Q72
Renesas Electronics Corporation
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$121.1750 | Yes | Active | 1.8 V | 1.54 V | 1 | 14 | 210 MHz | 4.76 ns | YES | ADC, PROPRIETARY METHOD | -1.54 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N72 | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 72 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 7 mm | 900 µm | 7 mm | RENESAS ELECTRONICS CORP | QFN | HVQCCN, | 72 | L72.10X10D | compliant | 3A991.C.3 | 8542.39.00.01 | Renesas Electronics | |||||
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KAD5514P-21Q72
Intersil Corporation
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Check for Price | Transferred | 1.8 V | 1.54 V | 1 | 0.0214 % | 14 | 210 MHz | 4.7 ns | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N72 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 72 | PLASTIC/EPOXY | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | INTERSIL CORP | QFN, QFN | HVQCCN, LCC72,.39SQ,20 | 48, 72 | compliant | 3A991.C.3 | 8542.39.00.01 |