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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Number of Channels | Bandwidth-Nom | Gain |
Package Code
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Output Power-Nom
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Harmonic Distortion
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Supply Voltage-Max (Vsup)
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Consumer IC Type
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Technology | Number of Functions |
Supply Current-Max
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Supply Voltage-Min (Vsup)
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Operating Temperature-Max
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Operating Temperature-Min
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Number of Terminals
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Package Body Material
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Part Package Code
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Pin Count
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| No | Obsolete | 2 | 20 kHz | LQFP | 15 V | AUDIO AMPLIFIER | BIPOLAR | 1 | 45 mA | 6 V | COMMERCIAL | Not Qualified | e0 | 70 °C | -20 °C | 12 | PLASTIC/EPOXY | SIP12,.1TB | NO | Tin/Lead (Sn/Pb) | 2.54 mm | SINGLE | SAMSUNG SEMICONDUCTOR INC | , SIP12,.1TB | unknown | EAR99 | 8542.33.00.01 | ||||||||||
| Obsolete | 2 | 20 kHz | 56.5 dB | SFM | 4.6 W | 10 % | 15 V | AUDIO AMPLIFIER | BIPOLAR | 1 | 45 mA | 6 V | COMMERCIAL | R-PSFM-T12 | Not Qualified | 70 °C | -20 °C | 12 | PLASTIC/EPOXY | SIP12,.1TB | RECTANGULAR | FLANGE MOUNT | NO | THROUGH-HOLE | 2.54 mm | SINGLE | SAMSUNG SEMICONDUCTOR INC | HEAT SINK, SIP-12 | compliant | EAR99 | 8542.33.00.01 | SFM | 12 |
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KA22065S
Samsung Semiconductor
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Check for Price Buy | No | Obsolete | 2 | 20 kHz | LQFP | 15 V | AUDIO AMPLIFIER | BIPOLAR | 1 | 45 mA | 6 V | COMMERCIAL | Not Qualified | e0 | 70 °C | -20 °C | 12 | PLASTIC/EPOXY | SIP12,.1TB | NO | Tin/Lead (Sn/Pb) | 2.54 mm | SINGLE | SAMSUNG SEMICONDUCTOR INC | , SIP12,.1TB | unknown | EAR99 | 8542.33.00.01 | |||||||||||
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KA22065
Samsung Semiconductor
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Check for Price Buy | Obsolete | 2 | 20 kHz | 56.5 dB | SFM | 4.6 W | 10 % | 15 V | AUDIO AMPLIFIER | BIPOLAR | 1 | 45 mA | 6 V | COMMERCIAL | R-PSFM-T12 | Not Qualified | 70 °C | -20 °C | 12 | PLASTIC/EPOXY | SIP12,.1TB | RECTANGULAR | FLANGE MOUNT | NO | THROUGH-HOLE | 2.54 mm | SINGLE | SAMSUNG SEMICONDUCTOR INC | HEAT SINK, SIP-12 | compliant | EAR99 | 8542.33.00.01 | SFM | 12 |