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K9F1G08Q0M-PIB00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 60 ns | FLASH | CONTAINS ADDITIONAL 32M BIT SPARE MEMORY | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||
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K9F1G08Q0M-PCB00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 60 ns | FLASH | CONTAINS ADDITIONAL 32M BIT SPARE MEMORY | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 1.95 V | 1.7 V | CMOS | COMMERCIAL | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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K9F1G08Q0M-YIB0
Samsung Semiconductor
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Check for Price | No | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 1.8 V | 30 ns | FLASH | CONTAINS ADDITIONAL 32M BIT NAND FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 1.8 V | YES | 50 µA | 15 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||
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K9F1G08Q0M-YCB0
Samsung Semiconductor
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Check for Price | No | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 1.8 V | 30 ns | FLASH | CONTAINS ADDITIONAL 32M BIT NAND FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 1.8 V | YES | 50 µA | 15 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | e0 | 70 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | compliant | EAR99 | 8542.32.00.51 | |||||
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K9F1G08Q0M-YIB00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 60 ns | FLASH | CONTAINS ADDITIONAL 32M BIT SPARE MEMORY | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||
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K9F1G08Q0M-PIB0
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 1.8 V | 60 ns | FLASH | YES | NO | 1K | 128000000 | 134.2177 M | 2K words | PARALLEL | YES | 50 µA | 15 µA | CMOS | INDUSTRIAL | NO | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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K9F1G08Q0M-YCB00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 60 ns | FLASH | CONTAINS ADDITIONAL 32M BIT SPARE MEMORY | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 1.8 V | 1.95 V | 1.7 V | CMOS | COMMERCIAL | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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K9F1G08Q0M-PCB0
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 1.8 V | 60 ns | FLASH | YES | NO | 1K | 128000000 | 134.2177 M | 2K words | PARALLEL | YES | 50 µA | 15 µA | CMOS | COMMERCIAL | NO | R-PDSO-G48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | compliant | EAR99 | 8542.32.00.51 |