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K4H560838F-ULB30
Samsung Semiconductor
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Check for Price | Yes | Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 700 ps | 166 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 3 mA | 280 µA | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 2 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSSOP66,.46 | 66 | compliant | EAR99 | 8542.32.00.24 | ||||||
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K4H560838F-TLB30
Samsung Semiconductor
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Check for Price | No | No | Active | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 700 ps | 166 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 3 mA | 280 µA | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | e0 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSSOP66,.46 | 66 | compliant | EAR99 | 8542.32.00.24 | |||||
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K4H560838F-ULAA0
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 750 ps | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 2 | 70 °C | 66 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSSOP, | 66 | compliant | EAR99 | 8542.32.00.24 | |||||||||||||||
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K4H560838F-ULB00
Samsung Semiconductor
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Check for Price | Yes | Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 750 ps | 133 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 3 mA | 250 µA | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 2 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSSOP66,.46 | 66 | compliant | EAR99 | 8542.32.00.24 | ||||||
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K4H560838F-TCB3
Samsung Semiconductor
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Check for Price | No | No | Contact Manufacturer | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 700 ps | 166 MHz | 8192 | DDR1 DRAM | COMMON | 2,4,8 | 32000000 | 33.5544 M | 3-STATE | 2,4,8 | 3 mA | 280 µA | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | e0 | 3 | 70 °C | 240 | 66 | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 635 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP66,.46 | compliant | EAR99 | 8542.32.00.24 | ||||||||||||||||
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K4H560838F-TLCC0
Samsung Semiconductor
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Check for Price | No | No | Active | 268.4355 Mbit | 8 | 32MX8 | 2.6 V | 650 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 4 mA | 310 µA | 2.7 V | 2.5 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | e0 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, TSSOP66,.46 | 66 | compliant | EAR99 | 8542.32.00.24 | |||||
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K4H560838F-UCCCT
Samsung Semiconductor
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Check for Price | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 2.6 V | 650 ps | FOUR BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.5 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, | 66 | compliant | EAR99 | 8542.32.00.24 | ||||||||||||||||||
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K4H560838F-ULA2
Samsung Semiconductor
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Check for Price | Yes | Yes | Contact Manufacturer | 268.4355 Mbit | 8 | 32MX8 | 2.5 V | 750 ps | 133 MHz | 8192 | DDR1 DRAM | COMMON | 2,4,8 | 32000000 | 33.5544 M | 3-STATE | 2,4,8 | 3 mA | 250 µA | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 3 | 70 °C | 260 | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 635 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP66,.46 | compliant | EAR99 | 8542.32.00.24 | |||||||||||||||||
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K4H560838F-TLCC
Samsung Semiconductor
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Check for Price | No | No | Contact Manufacturer | 268.4355 Mbit | 8 | 32MX8 | 2.6 V | 200 MHz | 8192 | DDR1 DRAM | COMMON | 2,4,8 | 32000000 | 33.5544 M | 3-STATE | 2,4,8 | 4 mA | 310 µA | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 1 | 70 °C | 66 | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 635 µm | DUAL | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP66,.46 | compliant | EAR99 | 8542.32.00.24 | ||||||||||||||||||||
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K4H560838F-UCC40
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 2.6 V | 650 ps | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.5 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | 2 | 70 °C | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, | 66 | compliant | EAR99 | 8542.32.00.24 |