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Manufacturer Part Number: k4b1g0446c
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K4B1G0446C-ZCG9
 Samsung Semiconductor 		Check for Price Yes Yes Obsolete 1.0737 Gbit 4 256MX4 1.5 V 255 ps 667 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified e3 1 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES MATTE TIN BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA94,11X19,32 compliant EAR99 8542.32.00.32
K4B1G0446C-ZCH9T
 Samsung Semiconductor 		Check for Price Yes Active 1.0737 Gbit 4 256MX4 1.5 V 255 ps 667 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.32
K4B1G0446C-ZCF8
 Samsung Semiconductor 		Check for Price Yes Yes Obsolete 1.0737 Gbit 4 256MX4 1.5 V 300 ps 533 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 3 260 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA94,11X19,32 compliant EAR99 8542.32.00.32
K4B1G0446C-ZCF7T
 Samsung Semiconductor 		Check for Price Yes Active 1.0737 Gbit 4 256MX4 1.5 V 400 ps 400 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.32
K4B1G0446C-ZCF8T
 Samsung Semiconductor 		Check for Price Yes Active 1.0737 Gbit 4 256MX4 1.5 V 300 ps 533 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.32
K4B1G0446C-ZCG8T
 Samsung Semiconductor 		Check for Price Yes Active 1.0737 Gbit 4 256MX4 1.5 V 300 ps 533 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.32
K4B1G0446C-ZCH9
 Samsung Semiconductor 		Check for Price Yes Yes Obsolete 1.0737 Gbit 4 256MX4 1.5 V 255 ps 667 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 3 260 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA94,11X19,32 compliant EAR99 8542.32.00.32
K4B1G0446C-ZCF70
 Samsung Semiconductor 		Check for Price Yes Obsolete 1.0737 Gbit 4 256MX4 1.5 V 400 ps 400 MHz 8192 MULTI BANK PAGE BURST DDR3 DRAM AUTO/SELF REFRESH COMMON 8 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 8 1.575 V 1.452 V CMOS COMMERCIAL EXTENDED R-PBGA-B94 Not Qualified 85 °C NOT SPECIFIED NOT SPECIFIED 94 PLASTIC/EPOXY TFBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 18 mm 11 mm SAMSUNG SEMICONDUCTOR INC TFBGA, BGA94,11X19,32 compliant EAR99 8542.32.00.32 BGA 94
K4B1G0446C-ZCG9T
 Samsung Semiconductor 		Check for Price Yes Active 1.0737 Gbit 4 256MX4 1.5 V 255 ps 667 MHz 8192 DDR3 DRAM COMMON 8 256000000 268.4355 M 3-STATE 8 CMOS R-PBGA-B94 Not Qualified 94 PLASTIC/EPOXY FBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.32
K4B1G0446C-ZCG80
 Samsung Semiconductor 		Check for Price Yes Obsolete 1.0737 Gbit 4 256MX4 1.5 V 300 ps 533 MHz 8192 MULTI BANK PAGE BURST DDR3 DRAM AUTO/SELF REFRESH COMMON 8 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 8 1.575 V 1.452 V CMOS COMMERCIAL EXTENDED R-PBGA-B94 Not Qualified 85 °C NOT SPECIFIED NOT SPECIFIED 94 PLASTIC/EPOXY TFBGA BGA94,11X19,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 18 mm 11 mm SAMSUNG SEMICONDUCTOR INC TFBGA, BGA94,11X19,32 compliant EAR99 8542.32.00.32 BGA 94
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