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IS61NP25632-100BI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 25 mA | 3.14 V | 350 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e0 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.41 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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IS61NP25632-150TQ
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 3.8 ns | 150 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 380 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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IS61NP25632-10TQI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | ZBT SRAM | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||
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IS61NP25632-5BI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 25 mA | 3.14 V | 350 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B119 | Not Qualified | e0 | 85 °C | -40 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.41 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IS61NP25632-150B
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 3.8 ns | 150 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 380 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.41 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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IS61NP25632-100TQ
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.14 V | 280 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IS61NP25632-100B
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.14 V | 280 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.41 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IS61NP25632-5TQ
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 300 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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IS61NP25632-133TQI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 310 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | QFP | TQFP-100 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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IS61NP25632-5B
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 32 | 256KX32 | 3.3 V | 5 ns | 100 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 300 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e0 | 70 °C | 119 | PLASTIC/EPOXY | BGA | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.41 mm | 22 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | BGA | PLASTIC, BGA-119 | 119 | compliant | 3A991.B.2.A | 8542.32.00.41 |