Parametric results for: is27lv256 under OTP ROMs

Filter Your Search

1 - 10 of 29 results

|
-
-
-
-
-
Manufacturer Part Number: is27lv256
Select parts from the table below to compare.
Compare
Compare
IS27LV256-70TI
Integrated Silicon Solution Inc
Check for Price No No Obsolete 262.144 kbit 8 32KX8 3 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e0 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 TSSOP28,.53,22 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP-28 28 compliant EAR99 8542.32.00.71
IS27LV256-15WI
Integrated Silicon Solution Inc
Check for Price No Active 262.144 kbit 8 32KX8 3.3 V 150 ns COMMON 32000 32.768 k 3-STATE 12.75 V 100 µA 30 µA CMOS INDUSTRIAL R-PDIP-T28 Not Qualified e0 85 °C -40 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEGRATED SILICON SOLUTION INC compliant EAR99 8542.32.00.71
IS27LV256-12PL
Integrated Silicon Solution Inc
Check for Price No Obsolete 262.144 kbit 8 32KX8 3 V 120 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 8 µA 3.6 V 2.7 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED SILICON SOLUTION INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IS27LV256-12TI
Integrated Silicon Solution Inc
Check for Price No No Obsolete 262.144 kbit 8 32KX8 3 V 120 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e0 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 TSSOP28,.53,22 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP-28 28 compliant EAR99 8542.32.00.71
IS27LV256-70PLI
Integrated Silicon Solution Inc
Check for Price No Obsolete 262.144 kbit 8 32KX8 3 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED SILICON SOLUTION INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IS27LV256-15TI
Integrated Silicon Solution Inc
Check for Price No No Obsolete 262.144 kbit 8 32KX8 3 V 150 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e0 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 TSSOP28,.53,22 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP-28 28 compliant EAR99 8542.32.00.71
IS27LV256-70PL
Integrated Silicon Solution Inc
Check for Price No Obsolete 262.144 kbit 8 32KX8 3 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 8 µA 3.6 V 2.7 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED SILICON SOLUTION INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IS27LV256-70W
Integrated Silicon Solution Inc
Check for Price No Obsolete 262.144 kbit 8 32KX8 3 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 8 µA 3.6 V 2.7 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.699 mm 36.576 mm 15.24 mm INTEGRATED SILICON SOLUTION INC DIP 0.600 INCH, PLASTIC, DIP-28 28 compliant EAR99 8542.32.00.71
IS27LV256-12PLI
Integrated Silicon Solution Inc
Check for Price No Obsolete 262.144 kbit 8 32KX8 3 V 120 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 20 µA 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED SILICON SOLUTION INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IS27LV256-90CWI
Integrated Silicon Solution Inc
Check for Price No Active 262.144 kbit 8 32KX8 3.3 V 90 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEGRATED SILICON SOLUTION INC compliant EAR99 8542.32.00.61