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IS27LV256-70TI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 70 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||
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IS27LV256-15WI
Integrated Silicon Solution Inc
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Check for Price | No | Active | 262.144 kbit | 8 | 32KX8 | 3.3 V | 150 ns | COMMON | 32000 | 32.768 k | 3-STATE | 12.75 V | 100 µA | 30 µA | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED SILICON SOLUTION INC | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||
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IS27LV256-12PL
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 120 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED SILICON SOLUTION INC | QFJ | PLASTIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | ||||
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IS27LV256-12TI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 120 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||
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IS27LV256-70PLI
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 70 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED SILICON SOLUTION INC | QFJ | PLASTIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | |||
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IS27LV256-15TI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 150 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||
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IS27LV256-70PL
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 70 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED SILICON SOLUTION INC | QFJ | PLASTIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | ||||
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IS27LV256-70W
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 70 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, PLASTIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||||
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IS27LV256-12PLI
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 120 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 20 µA | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED SILICON SOLUTION INC | QFJ | PLASTIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | |||
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IS27LV256-90CWI
Integrated Silicon Solution Inc
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Check for Price | No | Active | 262.144 kbit | 8 | 32KX8 | 3.3 V | 90 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 30 µA | CMOS | INDUSTRIAL | R-XDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED SILICON SOLUTION INC | compliant | EAR99 | 8542.32.00.61 |