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IS27HC512-55CWI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 524.288 kbit | 8 | 64KX8 | 5 V | 55 ns | UVPROM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | DUAL | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | ||||||||||
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IS27HC2048-45T
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 5 V | 45 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | SOP | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-40 | 40 | compliant | EAR99 | 8542.32.00.71 | ||||||||
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IS27HC256-55PL
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 50 µA | 15 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED SILICON SOLUTION INC | QFJ | PLASTIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | ||||
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IS27HC010-45CW
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | UVPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 75 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.715 mm | 41.91 mm | 15.24 mm | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, WINDOWED, CERDIP-32 | 32 | compliant | EAR99 | 8542.32.00.61 | |||||||
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IS27HC256-45TI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 50 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||
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IS27HC010-45T
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP-32 | 32 | compliant | EAR99 | 8542.32.00.71 | |||||
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IS27HC256-45WI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | OTP ROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, PLASTIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||
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IS27HC010-45CWI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | UVPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 90 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.715 mm | 41.91 mm | 15.24 mm | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, WINDOWED, CERDIP-32 | 32 | compliant | EAR99 | 8542.32.00.61 | ||||||
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IS27HC010-25W
Integrated Silicon Solution Inc
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 25 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 41.91 mm | 15.24 mm | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, PLASTIC, DIP-32 | 32 | compliant | EAR99 | 8542.32.00.71 | |||||
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IS27HC256-70CWI
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | DUAL | INTEGRATED SILICON SOLUTION INC | DIP | 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 |