Filter Your Search
1 - 10 of 20 results
|
IDT72V2105L15PFI
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | ||||
|
IDT72V2105L15PFI9
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 15 ns | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
IDT72V2105L10PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 6.5 ns | 10 ns | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | ||||||||
|
IDT72V2105L15PFGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 15 ns | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
IDT72V2105L20PF
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | ||||
|
IDT72V2105L15PF9
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 15 ns | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
IDT72V2105L20PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 12 ns | 20 ns | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
IDT72V2105L10PF
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.71 | ||||
|
IDT72V2105L15PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 15 ns | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
IDT72V2105L10PF9
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 6.5 ns | 10 ns | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.71 |