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Manufacturer Part Number: idt7200l12
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IDT7200L12TP
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.572 mm 34.671 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC DIP PLASTIC, DIP-28 28 not_compliant EAR99 8542.32.00.71
IDT7200L120L
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 120 ns 7 MHz 140 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CQCC-N32 Not Qualified e0 70 °C 32 CERAMIC, METAL-SEALED COFIRED QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC QFJ LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7200L120J
 Integrated Device Technology Inc 		Check for Price No Obsolete 2.304 kbit 9 256X9 5 V 120 ns 7 MHz 140 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7200L12SOG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 40 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC SOP, SOP28,.5 28 compliant EAR99 8542.32.00.71 1988-01-01
IDT7200L120LB
 Integrated Device Technology Inc 		Check for Price No No Obsolete 2.304 kbit 9 256X9 5 V 120 ns 7 MHz 140 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 900 µA 100 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N32 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 32 CERAMIC, METAL-SEALED COFIRED QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC QFJ LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT7200L120Y8
 Integrated Device Technology Inc 		Check for Price Transferred 2.304 kbit 9 256X9 5 V 120 ns 140 ns RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-J28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY SOJ RECTANGULAR SMALL OUTLINE YES TIN LEAD J BEND DUAL INTEGRATED DEVICE TECHNOLOGY INC SOJ 0.300 INCH, PLASTIC, SOJ-28 28 compliant EAR99 8542.32.00.71
IDT7200L12SOG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 40 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC SOP, SOP28,.5 28 compliant EAR99 8542.32.00.71 1988-01-01
IDT7200L120JB
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.304 kbit 9 256X9 5 V 120 ns 140 ns 1 256 256 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS MILITARY R-PQCC-J32 Not Qualified e0 125 °C -55 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IDT7200L12TD
 Integrated Device Technology Inc 		Check for Price No Obsolete 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-GDIP-T28 Not Qualified e0 70 °C 28 CERAMIC, GLASS-SEALED DIP DIP28,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.08 mm 37.1475 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC DIP CERAMIC, DIP-28 28 not_compliant EAR99 8542.32.00.71
IDT7200L12JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 1988-01-01
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