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Manufacturer Part Number: idt71v3559sa85
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IDT71V3559SA85BG8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, POWER, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BGG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BG
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BQI
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BQ
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BGI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BQGI
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, ROHS COMPLIANT, FBGA-165 165 unknown 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BQG
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 225 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, ROHS COMPLIANT, FBGA-165 165 unknown 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V3559SA85BGI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 235 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41