Findchips: Parametric Search Results for idt71t75802s200pf


Select Parts		Part Number

		IDT71T75802S200PF Integrated Device Technology Inc
		IDT71T75802S200PFGI Integrated Device Technology Inc
		IDT71T75802S200PFI Integrated Device Technology Inc
		IDT71T75802S200PFG8 Integrated Device Technology Inc
		IDT71T75802S200PFI8 Integrated Device Technology Inc
		IDT71T75802S200PF8 Integrated Device Technology Inc
		IDT71T75802S200PFG Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71T75802S200PF

Integrated Device Technology Inc

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PFI

Integrated Device Technology Inc

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PFI8

Integrated Device Technology Inc

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

2.38 V

2.625 V

2.375 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PF8

Integrated Device Technology Inc

Check for Price

Obsolete

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71T75802S200PFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

1MX18

2.5 V

3.2 ns

200 MHz

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

2.38 V

275 µA

2.625 V

2.375 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn) - annealed

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP, QFP100,.63X.87

100

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: idt71t75802s200pf under SRAMs