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Manufacturer Part Number: idt70v3399s133bf
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IDT70V3399S133BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B208 Not Qualified e1 3 70 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-CBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3399S133BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41