Findchips: Parametric Search Results for idt70t3539ms133bcg


Select Parts		Part Number

		IDT70T3539MS133BCGI8 Integrated Device Technology Inc
		IDT70T3539MS133BCGI Integrated Device Technology Inc
		IDT70T3539MS133BCG8 Integrated Device Technology Inc
		IDT70T3539MS133BCG Integrated Device Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

25 mA

2.4 V

900 µA

2.6 V

2.4 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

25 mA

2.4 V

900 µA

2.6 V

2.4 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

20 mA

2.4 V

740 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

20 mA

2.4 V

740 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT70T3539MS133BCGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

25 mA

2.4 V

900 µA

2.6 V

2.4 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70T3539MS133BCGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

25 mA

2.4 V

900 µA

2.6 V

2.4 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70T3539MS133BCG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

20 mA

2.4 V

740 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70T3539MS133BCG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

18.8744 Mbit

512KX36

2.5 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

20 mA

2.4 V

740 µA

2.6 V

2.4 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

260

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: idt70t3539ms133bcg under SRAMs