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IDT6167SA45DGB
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 45 ns | STANDARD SRAM | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T20 | Not Qualified | e3 | 125 °C | -55 °C | MIL-STD-883 Class B | 20 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 25.3365 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.300 INCH, CERDIP-20 | 20 | compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||||||
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IDT6167SA25DB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 25 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 10 mA | 4.5 V | 100 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T20 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 20 | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 25.3365 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.300 INCH, CERDIP-20 | 20 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||
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IDT6167SA15EB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 15 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 10 mA | 4.5 V | 130 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDFP-F20 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 20 | CERAMIC, GLASS-SEALED | DFP | FL20,.3 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 2.3368 mm | 6.9215 mm | INTEGRATED DEVICE TECHNOLOGY INC | DFP | 0.300 INCH, CERPACK-20 | 20 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||
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IDT6167SA55DGB
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 55 ns | STANDARD SRAM | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T20 | Not Qualified | e3 | 125 °C | -55 °C | MIL-STD-883 Class B | 20 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 25.3365 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.300 INCH, CERDIP-20 | 20 | compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||||||
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IDT6167SA70DI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 70 ns | STANDARD SRAM | SEPARATE | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | CMOS | INDUSTRIAL | R-XDIP-T20 | Not Qualified | e0 | 85 °C | -40 °C | 20 | CERAMIC | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||
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IDT6167SA25L
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 25 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5 mA | 4.5 V | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CQCC-N20 | Not Qualified | e0 | 70 °C | 20 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC20,.3X.43 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1.905 mm | 10.8585 mm | 7.366 mm | INTEGRATED DEVICE TECHNOLOGY INC | QLCC | 0.300 INCH, LCC-20 | 20 | not_compliant | EAR99 | 8542.32.00.41 | |||||||
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IDT6167SA35DI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 35 ns | STANDARD SRAM | SEPARATE | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | CMOS | INDUSTRIAL | R-XDIP-T20 | Not Qualified | e0 | 85 °C | -40 °C | 20 | CERAMIC | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||
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IDT6167SA35SO
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 35 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5 mA | 4.5 V | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G20 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.65 mm | 12.8 mm | 7.5 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | 0.300 INCH, SOIC-20 | 20 | not_compliant | EAR99 | 8542.32.00.41 | |||||
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IDT6167SA15E
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 15 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5 mA | 4.5 V | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDFP-F20 | Not Qualified | e0 | 70 °C | 20 | CERAMIC, GLASS-SEALED | DFP | FL20,.3 | RECTANGULAR | FLATPACK | YES | TIN LEAD | FLAT | 1.27 mm | DUAL | 2.337 mm | 6.9215 mm | INTEGRATED DEVICE TECHNOLOGY INC | DFP | 0.300 INCH, CERPACK-20 | 20 | not_compliant | EAR99 | 8542.32.00.41 | ||||||||
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IDT6167SA55D
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 55 ns | STANDARD SRAM | SEPARATE | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | CMOS | COMMERCIAL | R-XDIP-T20 | Not Qualified | e0 | 70 °C | 20 | CERAMIC | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 |