Parametric results for: ic-512 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Length Contact Finish Mating Contact Material Contact Style Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

WITH FLOATING BASE 8

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1.102 inch 5 1.244 inch 1 1.26 inch 2 1.417 inch 1

Min (inch) - Max (inch)

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1.102 inch 5 1.244 inch 1 1.26 inch 2 1.417 inch 1

Min (inch) - Max (inch)

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AU ON NI 9

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Contact Material (1)

BE-CU 9

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BELLOWED TYPE 9

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IC SOCKET 23

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QFP208 13 QFP240 3 QFP244 1 QFP256 4 QFP272 1 TCP244 1

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700VAC V 9

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POLYETHERIMIDE 1 POLYETHERSULFONE 1 POLYSULPHONE 21

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1 GΩ 9

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e0 4

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Manufacturer (2)

Integrated Device Technology Inc 4 Yamaichi Electronics Co Ltd 23

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0.016 inch 4 0.02 inch 5

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STRAIGHT 9

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Number of Contacts (5)

208 13 240 3 244 2 256 4 272 1

Min - Max

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70.0 °C 2 85.0 °C 2

Min (°C) - Max (°C)

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-40.0 °C 2 0.0 °C 2

Min (°C) - Max (°C)

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STAGGERED 9

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Contact Manufacturer 23 Obsolete 4

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No 4

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Terminal Pitch (3)

990.6 µm 2 1.27 mm 4 1.6002 mm 1

Min (mm) - Max (mm)

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SOLDER 9

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