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HYB18T1G400AF-5
Infineon Technologies AG
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Check for Price | Yes | Transferred | 1.0737 Gbit | 4 | 256MX4 | 1.8 V | 600 ps | 200 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B68 | Not Qualified | e1 | 95 °C | 68 | PLASTIC/EPOXY | TFBGA | BGA68,9X19,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 20 mm | 10 mm | INFINEON TECHNOLOGIES AG | BGA | TFBGA, BGA68,9X19,32 | 68 | compliant | EAR99 | 8542.32.00.32 | |||
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HYB18T1G400AF-5
Qimonda AG
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 4 | 256MX4 | 1.8 V | 600 ps | 200 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B68 | Not Qualified | 3 | 95 °C | 68 | PLASTIC/EPOXY | TFBGA | BGA68,9X19,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 20 mm | 10 mm | QIMONDA AG | BGA | TFBGA, BGA68,9X19,32 | 68 | unknown | EAR99 | 8542.32.00.32 |