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HY27US08561A-SMS
SK Hynix Inc
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Check for Price | No | No | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 3.3 V | 30 ns | FLASH | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | PARALLEL | 3.3 V | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | VSSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, | 48 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||
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HY27US08561A-FCB
SK Hynix Inc
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Check for Price | No | No | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SK HYNIX INC | BGA | VFBGA, BGA63,10X12,32 | 63 | compliant | EAR99 | 8542.32.00.51 | |||||
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HY27US08561A-TPEB
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | e6 | 85 °C | -25 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN BISMUTH | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SK HYNIX INC | TSOP1 | TSOP1, TSSOP48,.8,20 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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HY27US08561A-SPIP
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 260 | 20 | 48 | PLASTIC/EPOXY | VSSOP | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, TSSOP48,.71,20 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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HY27US08561A-FEB
SK Hynix Inc
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Check for Price | No | No | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SK HYNIX INC | BGA | VFBGA, BGA63,10X12,32 | 63 | compliant | EAR99 | 8542.32.00.51 | ||||
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HY27US08561A-SPMP
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 3.3 V | 30 ns | FLASH | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | PARALLEL | 3.3 V | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -30 °C | 260 | 20 | 48 | PLASTIC/EPOXY | VSSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, | 48 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||
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HY27US08561A-SPMS
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 3.3 V | 30 ns | FLASH | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | PARALLEL | 3.3 V | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -30 °C | 260 | 20 | 48 | PLASTIC/EPOXY | VSSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, | 48 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||
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HY27US08561A-SEB
SK Hynix Inc
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Check for Price | No | No | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | VSSOP | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, TSSOP48,.71,20 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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HY27US08561A-SPEP
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 16K | 32MX8 | 3.3 V | 30 ns | FLASH | YES | NO | 1 | 2K | 32000000 | 33.5544 M | ASYNCHRONOUS | 512 words | PARALLEL | 3.3 V | YES | 50 µA | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | 85 °C | -25 °C | 260 | 20 | 48 | PLASTIC/EPOXY | VSSOP | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 650 µm | 15.4 mm | 12 mm | SK HYNIX INC | SOIC | VSSOP, TSSOP48,.71,20 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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HY27US08561A-TPMP
SK Hynix Inc
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Check for Price | Yes | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 3.3 V | 30 ns | FLASH | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | PARALLEL | 3.3 V | 20 µA | 3.6 V | 2.7 V | CMOS | OTHER | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | e6 | 85 °C | -30 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN BISMUTH | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SK HYNIX INC | TSOP1 | TSOP1, | 48 | compliant | EAR99 | 8542.32.00.51 |