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HS1-303ARH-8
Renesas Electronics Corporation
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Check for Price | Yes | Active | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | RENESAS ELECTRONICS CORP | SBDIP | DIP, | 14 | D14.3 | compliant | 8542.39.00.01 | Renesas Electronics | ||||||||||
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HS1-303ARH/PROTO
Renesas Electronics Corporation
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Check for Price | Yes | Active | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | RENESAS ELECTRONICS CORP | SBDIP | DIP, | 14 | D14.3 | compliant | 8542.39.00.01 | Renesas Electronics | ||||||||||
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HS1-303ARH-Q
Renesas Electronics Corporation
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Check for Price | Yes | Active | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | RENESAS ELECTRONICS CORP | SBDIP | DIP, | 14 | D14.3 | compliant | 8542.39.00.01 | Renesas Electronics | ||||||||||
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HS1-303ARH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 15 V | NO | -15 V | 75 Ω | 500 ns | SPDT | CMOS | 1 | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 38535V;38534K;883S | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | INTERSIL CORP | DIP | DIP, DIP14,.3 | 14 | compliant | 8542.39.00.01 | ||||||
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HS1-303ARH-8
Intersil Corporation
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Check for Price | Yes | Transferred | 15 V | NO | -15 V | 75 Ω | 500 ns | SPDT | CMOS | 1 | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | INTERSIL CORP | DIP | DIP, DIP14,.3 | 14 | compliant | 8542.39.00.01 | USML XV(E) | |||||
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HS1-303ARH/PROTO
Intersil Corporation
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Check for Price | Yes | Transferred | 15 V | NO | -15 V | SPDT | CMOS | 1 | 2 | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | INTERSIL CORP | DIP | DIP, | 14 | compliant | 8542.39.00.01 |