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Manufacturer Part Number: hm66wp36513
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HM66WP36513BP-75
 Renesas Electronics Corporation 		Check for Price Contact Manufacturer 18.8744 Mbit 36 512KX36 2.5 V 7.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm RENESAS ELECTRONICS CORP BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
HM66WP36513BP-65
 Hitachi Ltd 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 6.5 ns 133 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 2.37 V 250 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm HITACHI LTD BGA BGA, BGA119,7X17,50 119 unknown 3A991.B.2.A 8542.32.00.41
HM66WP36513BP-65
 Renesas Electronics Corporation 		Check for Price Contact Manufacturer 18.8744 Mbit 36 512KX36 2.5 V 6.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm RENESAS ELECTRONICS CORP BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
HM66WP36513FP-65
 Hitachi Ltd 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 6.5 ns 133 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 2.37 V 250 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm HITACHI LTD QFP LQFP, QFP100,.63X.87 100 unknown 3A991.B.2.A 8542.32.00.41
HM66WP36513BP-85
 Hitachi Ltd 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 8.5 ns 100 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 2.37 V 200 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm HITACHI LTD BGA BGA, BGA119,7X17,50 119 unknown 3A991.B.2.A 8542.32.00.41
HM66WP36513FP-85
 Hitachi Ltd 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 8.5 ns 100 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 2.37 V 200 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm HITACHI LTD QFP LQFP, QFP100,.63X.87 100 unknown 3A991.B.2.A 8542.32.00.41
HM66WP36513FP-65
 Renesas Electronics Corporation 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 6.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
HM66WP36513BP-75
 Hitachi Ltd 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 7.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm HITACHI LTD BGA BGA, 119 unknown 3A991.B.2.A 8542.32.00.41
HM66WP36513BP-85
 Renesas Electronics Corporation 		Check for Price Contact Manufacturer 18.8744 Mbit 36 512KX36 2.5 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.35 mm 22 mm 14 mm RENESAS ELECTRONICS CORP BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
HM66WP36513FP-85
 Renesas Electronics Corporation 		Check for Price Transferred 18.8744 Mbit 36 512KX36 2.5 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
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