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HD74LV1GW16ACME
Renesas Electronics Corporation
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Check for Price | Active | 1.8 V | 33 ns | 12 ns | 2 | 1 | YES | TSSOP | 50 pF | NO | LV/LV-A/LVX/H | BUFFER | CMOS | 6 mA | 5.5 V | 1.65 V | INDUSTRIAL | R-PDSO-G6 | Not Qualified | e6 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | TSSOP6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | TIN BISMUTH | GULL WING | 650 µm | DUAL | 1.1 mm | 1.25 mm | 2 mm | RENESAS ELECTRONICS CORP | SOIC | TSSOP, TSSOP6,.08 | 6 | compliant | 8542.39.00.01 | ||||||
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74LV1GW16ACME-E
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | 33 ns | 12 ns | 2 | 1 | YES | TSSOP | 50 pF | NO | LV/LV-A/LVX/H | BUFFER | CMOS | 6 mA | 5.5 V | 1.65 V | INDUSTRIAL | R-PDSO-G6 | Not Qualified | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | TSSOP6,.08 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | GULL WING | 635 µm | DUAL | RENESAS ELECTRONICS CORP | CMPAK | TSSOP, TSSOP6,.08 | 6 | compliant | 8542.39.00.01 | PTSP0006JA | Renesas Electronics |