Findchips: Parametric Search Results for hcs244

Parametric results for: hcs244 under Sockets and Chip Carriers

Select parts from the table below to compare.

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Select Parts		Part Number

		1-HCS244-29TT Advanced Interconnections Corp
		HCS244DMSH Harris Semiconductor
		HCS244DMSH Intersil Corporation
		2-HCS244-49TG Advanced Interconnections Corp
		3-HCS244-29TT Advanced Interconnections Corp
		3-HCS244-49TT Advanced Interconnections Corp
		HCS244-01TG Advanced Interconnections Corp
		5962R9573101VRC Intersil Corporation
		HCS244HMSR Intersil Corporation
		3-HCS244-04GG Advanced Interconnections Corp

				Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Control Type	Family	JESD-30 Code	Load Capacitance (CL)	Logic IC Type	Max I(ol)	Number of Bits	Number of Functions	Number of Ports	Number of Terminals	Output Characteristics	Output Polarity	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Power Supply Current-Max (ICC)	Prop. Delay@Nom-Sup	Propagation Delay (tpd)	Qualification Status	Screening Level	Seated Height-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Position	Total Dose	Width	Part Package Code	Pin Count

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

2.54 mm

RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

HC/UH

R-CDIP-T20

50 pF

BUS DRIVER

5 mA

3-STATE

TRUE

CERAMIC, METAL-SEALED COFIRED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

3.75 mA

32 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

TIN LEAD

THROUGH-HOLE

DUAL

1M Rad(Si) V

7.62 mm

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

R-XDIP-T20

50 pF

BUS DRIVER

5 mA

3-STATE

TRUE

CERAMIC

DIP

DIP20,.3

RECTANGULAR

IN-LINE

3.75 mA

32 ns

Not Qualified

38535V;38534K;883S

5 V

CMOS

MILITARY

Tin/Lead (Sn/Pb)

THROUGH-HOLE

DUAL

1M Rad(Si) V

DIP

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Yes

Transferred

2.54 mm

125 °C

-55 °C

INTERSIL CORP

compliant

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

HC/UH

R-CDIP-T20

50 pF

BUS DRIVER

6 mA

3-STATE

TRUE

CERAMIC, METAL-SEALED COFIRED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

25 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

GOLD

THROUGH-HOLE

DUAL

100k Rad(Si) V

7.62 mm

DIP

Check for Price

Obsolete

INTERSIL CORP

unknown

DIE,

HC/UH

R-XUUC-N20

BUS DRIVER

3-STATE

TRUE

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

21 ns

Not Qualified

MIL-PRF-38535 Class V

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

200k Rad(Si) V

DIE

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1 2 3 4 5 Next

Compare

1-HCS244-29TT

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS244DMSH

Harris Semiconductor

Check for Price

Obsolete

2.54 mm

RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

HC/UH

R-CDIP-T20

50 pF

BUS DRIVER

5 mA

3-STATE

TRUE

CERAMIC, METAL-SEALED COFIRED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

3.75 mA

32 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

TIN LEAD

THROUGH-HOLE

DUAL

1M Rad(Si) V

7.62 mm

HCS244DMSH

Intersil Corporation

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

R-XDIP-T20

50 pF

BUS DRIVER

5 mA

3-STATE

TRUE

CERAMIC

DIP

DIP20,.3

RECTANGULAR

IN-LINE

3.75 mA

32 ns

Not Qualified

38535V;38534K;883S

5 V

CMOS

MILITARY

Tin/Lead (Sn/Pb)

THROUGH-HOLE

DUAL

1M Rad(Si) V

DIP

2-HCS244-49TG

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

3-HCS244-29TT

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

3-HCS244-49TT

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS244-01TG

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

5962R9573101VRC

Intersil Corporation

Check for Price

Yes

Transferred

2.54 mm

125 °C

-55 °C

INTERSIL CORP

compliant

8542.39.00.01

DIP, DIP20,.3

ENABLE LOW

HC/UH

R-CDIP-T20

50 pF

BUS DRIVER

6 mA

3-STATE

TRUE

CERAMIC, METAL-SEALED COFIRED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

25 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

GOLD

THROUGH-HOLE

DUAL

100k Rad(Si) V

7.62 mm

DIP

HCS244HMSR

Intersil Corporation

Check for Price

Obsolete

INTERSIL CORP

unknown

DIE,

HC/UH

R-XUUC-N20

BUS DRIVER

3-STATE

TRUE

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

21 ns

Not Qualified

MIL-PRF-38535 Class V

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

200k Rad(Si) V

DIE

3-HCS244-04GG

Advanced Interconnections Corp

Check for Price

Obsolete

244

BE-CU

2.54 mm

IC SOCKET

PGA244

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

22X22

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

2.2 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1 2 3 4 5 Next