Findchips: Parametric Search Results for hcs05ms

Parametric results for: hcs05ms under Sockets and Chip Carriers

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		1-HCS050-04TG Advanced Interconnections Corp
		HCS056-344TG Advanced Interconnections Corp
		HCS052-29GT Advanced Interconnections Corp
		2-HCS053-51GG Advanced Interconnections Corp
		HCS050-149GG Advanced Interconnections Corp
		HCS053-29TT Advanced Interconnections Corp
		HCS057-151TT Advanced Interconnections Corp
		5962R9580101VCC Intersil Corporation
		HCS050-29TT Advanced Interconnections Corp
		2HCS052-153GT Advanced Interconnections Corp

			Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Pin Count	Family	JESD-30 Code	Length	Load Capacitance (CL)	Logic IC Type	Max I(ol)	Number of Functions	Number of Inputs	Number of Terminals	Output Characteristics	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Prop. Delay@Nom-Sup	Propagation Delay (tpd)	Qualification Status	Schmitt Trigger	Screening Level	Seated Height-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Position	Total Dose	Width

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA56

260 °C

-60 °C

9X9

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA52

150 °C

-60 °C

9X9

SN-PB ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA53

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

9X9

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

260 °C

-60 °C

14X14

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA53

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

9X9

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA57

260 °C

-60 °C

9X9

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

unknown

8542.39.00.01

DIP

DIP, DIP14,.3

HC/UH

R-CDIP-T14

19.43 mm

50 pF

INVERTER

4 mA

OPEN-DRAIN

CERAMIC, METAL-SEALED COFIRED

DIP

DIP14,.3

RECTANGULAR

IN-LINE

20 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

GOLD

THROUGH-HOLE

DUAL

100k Rad(Si) V

7.62 mm

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA52

260 °C

-60 °C

9X9

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1 2 3 4 5 Next

Compare

1-HCS050-04TG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS056-344TG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA56

260 °C

-60 °C

9X9

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS052-29GT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA52

150 °C

-60 °C

9X9

SN-PB ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

2-HCS053-51GG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA53

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

9X9

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS050-149GG

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

260 °C

-60 °C

14X14

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS053-29TT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA53

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

9X9

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS057-151TT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA57

260 °C

-60 °C

9X9

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.13 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

5962R9580101VCC

Intersil Corporation

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

unknown

8542.39.00.01

DIP

DIP, DIP14,.3

HC/UH

R-CDIP-T14

19.43 mm

50 pF

INVERTER

4 mA

OPEN-DRAIN

CERAMIC, METAL-SEALED COFIRED

DIP

DIP14,.3

RECTANGULAR

IN-LINE

20 ns

Not Qualified

38535V;38534K;883S

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

GOLD

THROUGH-HOLE

DUAL

100k Rad(Si) V

7.62 mm

HCS050-29TT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA50

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

2HCS052-153GT

Advanced Interconnections Corp

Check for Price

Obsolete

BE-CU

2.54 mm

IC SOCKET

PGA52

260 °C

-60 °C

9X9

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

0.9 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1 2 3 4 5 Next