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GS8182D19BD-300IT
GSI Technology
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Check for Price Buy | No | No | End Of Life | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 165 mA | 1.7 V | 500 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 10 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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GS8182D19BD-300I
GSI Technology
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Check for Price Buy | No | No | End Of Life | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 165 mA | 1.7 V | 500 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 10 mm | GSI TECHNOLOGY | BGA | LBGA, BGA165,11X15,40 | 165 | not_compliant | 3A991.B.2.B | 8542.32.00.41 |