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Parametric » Signal Circuits » Other Signal Circuits

Parametric results for: fx5545g0063v8b1 under Other Signal Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		FX5545G0063V3T2 Telefunken Microelectronics Gmbh
		FX5545G0063V3SMB1 Vishay Intertechnologies
		FX5545G0063V3T1 Telefunken Microelectronics Gmbh
		FX5545G0063V3B5 Telefunken Microelectronics Gmbh
		FX5545G0063V3B1 Telefunken Microelectronics Gmbh

			Most Relevant			Technical				Compliance			Operating Conditions		Physical										Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Output Voltage-Nom	Output Current-Max	Technology	Input Voltage-Max	Input Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Reach Compliance Code	HTS Code	Package Description

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

Check for Price

No

Obsolete

YES

3.3 V

1.5 A

HYBRID

6 V

2.5 V

INDUSTRIAL

R-PQCC-N20

Not Qualified

85 °C

-40 °C

20

PLASTIC/EPOXY

QCCN

LCC20,.6X.67,100

RECTANGULAR

CHIP CARRIER

NO LEAD

2.54 mm

QUAD

VISHAY INTERTECHNOLOGY INC

unknown

8542.39.00.01

QCCN, LCC20,.6X.67,100

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

Compare

FX5545G0063V3T2

Telefunken Microelectronics Gmbh

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

FX5545G0063V3SMB1

Vishay Intertechnologies

Check for Price

No

Obsolete

YES

3.3 V

1.5 A

HYBRID

6 V

2.5 V

INDUSTRIAL

R-PQCC-N20

Not Qualified

85 °C

-40 °C

20

PLASTIC/EPOXY

QCCN

LCC20,.6X.67,100

RECTANGULAR

CHIP CARRIER

NO LEAD

2.54 mm

QUAD

VISHAY INTERTECHNOLOGY INC

unknown

8542.39.00.01

QCCN, LCC20,.6X.67,100

FX5545G0063V3T1

Telefunken Microelectronics Gmbh

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

FX5545G0063V3B5

Telefunken Microelectronics Gmbh

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01

FX5545G0063V3B1

Telefunken Microelectronics Gmbh

Check for Price

No

Transferred

YES

3.3 V

1.5 A

HYBRID

6 V

2.7 V

INDUSTRIAL

R-PBGA-B20

Not Qualified

e0

85 °C

-40 °C

20

PLASTIC/EPOXY

BGA

BGA20,4X5,100

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

2.54 mm

BOTTOM

TELEFUNKEN MICROELECTRONICS GMBH

unknown

8542.39.00.01