Findchips: Parametric Search Results for ft230x.


Select Parts		Part Number

		FT230XQ-T FTDI Chip
		FT230XQ-R FTDI Chip
		FT230XS-R FTDI Chip
		FT230XQ-U FTDI Chip
		FT230XS-U FTDI Chip

			Most Relevant					Technical					Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Data Transfer Rate-Max	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Bus Compatibility	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$1.9954

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

800 µm

4 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

HVQCCN, LCC16,.16SQ,25

compliant

EAR99

8542.31.00.01

FTDI Chip

$2.2926

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

800 µm

4 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

QFN-16

compliant

EAR99

8542.31.00.01

FTDI Chip

$2.3220

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

R-PDSO-G16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

635 µm

DUAL

1.7526 mm

3.9116 mm

4.9022 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

compliant

EAR99

8542.31.00.01

FTDI Chip

Check for Price

Yes

Active

MICROPROCESSOR CIRCUIT

CMOS

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

compliant

8542.31.00.01

Check for Price

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

R-PDSO-G16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

635 µm

DUAL

1.7526 mm

3.9116 mm

4.9022 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

SSOP, SSOP16,.25

compliant

EAR99

8542.31.00.01

FTDI Chip

Compare

FT230XQ-T

FTDI Chip

$1.9954

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

800 µm

4 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

HVQCCN, LCC16,.16SQ,25

compliant

EAR99

8542.31.00.01

FTDI Chip

FT230XQ-R

FTDI Chip

$2.2926

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

S-XQCC-N16

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

650 µm

QUAD

800 µm

4 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

QFN-16

compliant

EAR99

8542.31.00.01

FTDI Chip

FT230XS-R

FTDI Chip

$2.3220

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

R-PDSO-G16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

635 µm

DUAL

1.7526 mm

3.9116 mm

4.9022 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

compliant

EAR99

8542.31.00.01

FTDI Chip

FT230XQ-U

FTDI Chip

Check for Price

Yes

Active

MICROPROCESSOR CIRCUIT

CMOS

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

compliant

8542.31.00.01

FT230XS-U

FTDI Chip

Check for Price

Yes

Active

60 MBps

12.02 MHz

YES

5 V

BUS CONTROLLER, UNIVERSAL SERIAL BUS

CMOS

UART, USB

8.3 mA

5.5 V

2.97 V

R-PDSO-G16

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

635 µm

DUAL

1.7526 mm

3.9116 mm

4.9022 mm

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

SSOP, SSOP16,.25

compliant

EAR99

8542.31.00.01

FTDI Chip

Parametric results for: ft230x. under Other uPs/uCs/Peripheral ICs