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Parametric » Power Circuits » Power Management Circuits

Parametric results for: fsa831l10x under Power Management Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		FSA831L10X-F131 Fairchild Semiconductor Corporation
		FSA831L10X onsemi
		FSA831L10X Fairchild Semiconductor Corporation

				Most Relevant							Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Manufacturer Package Code	Samacsys Manufacturer	Pin Count

Check for Price

Yes

Obsolete

e4

1

260

30

NICKEL PALLADIUM GOLD

FAIRCHILD SEMICONDUCTOR CORP

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

5 V

4 V

6 V

400 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-XQCC-N10

e4

Not Qualified

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

HVQCCN

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

500 µm

QUAD

1.6 mm

2.1 mm

550 µm

ONSEMI

compliant

EAR99

8542.39.00.01

UQFN-10

MICROPAK-10

523AZ

onsemi

Check for Price

Yes

Yes

Transferred

5 V

4 V

6 V

400 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-XQCC-N10

e4

Not Qualified

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

HVQCCN

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

500 µm

QUAD

1.6 mm

2.1 mm

550 µm

FAIRCHILD SEMICONDUCTOR CORP

compliant

EAR99

8542.39.00.01

MICROPAK MLP

1.60 X 2.10 MM, 0.50 MM PITCH, MO-255UABD, MICROPAK-10

10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED)

10

Compare

FSA831L10X-F131

Fairchild Semiconductor Corporation

Check for Price

Yes

Obsolete

e4

1

260

30

NICKEL PALLADIUM GOLD

FAIRCHILD SEMICONDUCTOR CORP

compliant

EAR99

8542.39.00.01

onsemi

Check for Price

Yes

Obsolete

5 V

4 V

6 V

400 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-XQCC-N10

e4

Not Qualified

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

HVQCCN

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

500 µm

QUAD

1.6 mm

2.1 mm

550 µm

ONSEMI

compliant

EAR99

8542.39.00.01

UQFN-10

MICROPAK-10

523AZ

onsemi

Fairchild Semiconductor Corporation

Check for Price

Yes

Yes

Transferred

5 V

4 V

6 V

400 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-XQCC-N10

e4

Not Qualified

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

HVQCCN

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

500 µm

QUAD

1.6 mm

2.1 mm

550 µm

FAIRCHILD SEMICONDUCTOR CORP

compliant

EAR99

8542.39.00.01

MICROPAK MLP

1.60 X 2.10 MM, 0.50 MM PITCH, MO-255UABD, MICROPAK-10

10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED)

10