Findchips: Parametric Search Results for dspic33fj32gs606e/mr


	Part Number

DSPIC33FJ32GS606-E/MR

Microchip Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	RAM (words)	Clock Frequency-Max	Number of Timers	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Barrel Shifter	Boundary Scan	Format	Integrated Cache	Internal Bus Architecture	Low Power Mode	Number of DMA Channels	Number of External Interrupts	Number of Serial I/Os	On Chip Data RAM Width	ROM Programmability	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$6.4978

Yes

Active

4096

40 MHz

YES

3.3 V

DIGITAL SIGNAL PROCESSOR, CONTROLLER

CMOS

YES

FIXED POINT

MULTIPLE

YES

FLASH

170 mA

3.6 V

3 V

AUTOMOTIVE

S-PQCC-N64

Not Qualified

125 °C

-40 °C

260

AEC-Q100; TS 16949

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

9 mm

MICROCHIP TECHNOLOGY INC

QFN

9 X 9 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-64

compliant

3A991.A.2

8542.31.00.01

Microchip

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