Parametric results for: cy7c1425kv18 under SRAMs

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Manufacturer Part Number: cy7c1425kv18
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CY7C1425KV18-250BZCT
Cypress Semiconductor
Check for Price No Transferred 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz STANDARD SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1425KV18-250BZXI
Infineon Technologies AG
Check for Price Yes Obsolete 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS R-PBGA-B165 e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG FBGA-165 compliant
CY7C1425KV18-250BZC
Infineon Technologies AG
Check for Price No Active 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS R-PBGA-B165 e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG FBGA-165 compliant
CY7C1425KV18-333BZXC
Infineon Technologies AG
Check for Price Yes Active 37.7487 Mbit 9 4MX9 1.8 V 450 ps 333 MHz QDR SRAM PIPELINED ARCHITECTURE 1 4000000 4.1943 M SYNCHRONOUS NO PARALLEL 280 mA 1.7 V 730 µA 1.9 V 1.7 V CMOS R-PBGA-B165 e1 3 70 °C 260 NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG FBGA-165 compliant
CY7C1425KV18-250BZXI
Cypress Semiconductor
Check for Price Yes Transferred 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41 BGA 165
CY7C1425KV18-333BZXC
Cypress Semiconductor
Check for Price Yes Transferred 37.7487 Mbit 9 4MX9 1.8 V 450 ps QDR SRAM PIPELINED ARCHITECTURE 1 4000000 4.1943 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 e1 3 70 °C 260 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP FBGA-165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1425KV18-250BZXC
Cypress Semiconductor
Check for Price Yes Transferred 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41 BGA 165
CY7C1425KV18-250BZC
Cypress Semiconductor
Check for Price No Transferred 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41 BGA 165
CY7C1425KV18-250BZXC
Infineon Technologies AG
Check for Price Yes Obsolete 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS R-PBGA-B165 e1 3 70 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG FBGA-165 compliant
CY7C1425KV18-250BZI
Infineon Technologies AG
Check for Price No Obsolete 37.7487 Mbit 9 4MX9 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 260 mA 1.7 V 590 µA 1.9 V 1.7 V CMOS R-PBGA-B165 e0 3 85 °C -40 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG FBGA-165 compliant