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Manufacturer Part Number: cy7c1423kv18
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CY7C1423KV18-250BZC
 Cypress Semiconductor 		$36.3889 No Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 250 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 430 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-250BZXC
 Cypress Semiconductor 		$36.3889 Yes Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 250 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 430 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-300BZXCT
 Cypress Semiconductor 		$36.8550 Yes Yes Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 300 MHz STANDARD SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 270 mA 1.7 V 460 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-300BZC
 Cypress Semiconductor 		$39.6771 No Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 300 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 270 mA 1.7 V 460 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-300BZXC
 Cypress Semiconductor 		$39.6771 Yes Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 300 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 270 mA 1.7 V 460 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-333BZXC
 Cypress Semiconductor 		$44.5332 Yes Transferred 37.7487 Mbit 18 2MX18 1.8 V 450 ps 333 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 280 mA 1.7 V 490 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1423KV18-333BZXC
 Infineon Technologies AG 		Check for Price Yes End Of Life 37.7487 Mbit 18 2MX18 1.8 V 450 ps 333 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 280 mA 1.7 V 490 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant Infineon
CY7C1423KV18-250BZC
 Infineon Technologies AG 		Check for Price No Obsolete 37.7487 Mbit 18 2MX18 1.8 V 450 ps 250 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 430 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant
CY7C1423KV18-300BZC
 Infineon Technologies AG 		Check for Price No Obsolete 37.7487 Mbit 18 2MX18 1.8 V 450 ps 300 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 270 mA 1.7 V 460 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant
CY7C1423KV18-250BZXC
 Infineon Technologies AG 		Check for Price Yes Obsolete 37.7487 Mbit 18 2MX18 1.8 V 450 ps 250 MHz DDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 260 mA 1.7 V 430 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant
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