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CY7C1318KV18-250BZXI
Cypress Semiconductor
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Check for Price | Yes | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | e1 | 3 | 85 °C | -40 °C | 220 | 30 | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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CY7C1318KV18-250BZCT
Cypress Semiconductor
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Check for Price | No | No | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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CY7C1318KV18-300BZXC
Cypress Semiconductor
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Check for Price | Yes | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 430 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1318KV18-250BZXC
Cypress Semiconductor
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Check for Price | Yes | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1318KV18-300BZXC
Infineon Technologies AG
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Check for Price | Yes | End Of Life | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 300 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 430 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | FBGA-165 | compliant | |||||||||
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CY7C1318KV18-250BZCT
Infineon Technologies AG
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Check for Price | No | Obsolete | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | |||||||||
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CY7C1318KV18-250BZC
Cypress Semiconductor
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Check for Price | No | No | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1318KV18-250BZXC
Infineon Technologies AG
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Check for Price | Yes | Active | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | FBGA-165 | compliant | Infineon | ||||||||
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CY7C1318KV18-250BZXI
Infineon Technologies AG
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Check for Price | Yes | Obsolete | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | e1 | 3 | 85 °C | -40 °C | 220 | 30 | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | FBGA-165 | compliant | Infineon | |||||||||||||||
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CY7C1318KV18-250BZI
Cypress Semiconductor
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Check for Price | No | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 250 mA | 1.7 V | 380 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |