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CY7C1150KV18-400BZXI
Infineon Technologies AG
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Check for Price | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 400 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 640 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | FBGA-165 | compliant | ||||
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CY7C1150KV18-400BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 400 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 640 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1150KV18-400BZXI
Cypress Semiconductor
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Check for Price | Yes | Transferred | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 400 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 640 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1150KV18-400BZXC
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 400 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 290 mA | 1.7 V | 640 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||
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CY7C1150KV18-450BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 1.8 V | 450 ps | 450 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 310 mA | 1.7 V | 700 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 |