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CY62167DV30LL-70BVI
Infineon Technologies AG
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$11.4953 | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | STANDARD SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 25 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 750 µm | BOTTOM | 1 mm | 9.5 mm | 8 mm | INFINEON TECHNOLOGIES AG | 8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48 | compliant | Infineon | |||||||||
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CY62167DV30LL-70BVI
Cypress Semiconductor
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$12.6997 | No | No | Transferred | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | STANDARD SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 25 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | 9.5 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | 8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48 | compliant | BGA | 48 | 3A991.B.2.A | 8542.32.00.41 | ||||||
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CY62167DV30LL-55BVXIT
Infineon Technologies AG
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$15.0433 | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 55 ns | STANDARD SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 30 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 750 µm | BOTTOM | 1 mm | 9.5 mm | 8 mm | INFINEON TECHNOLOGIES AG | 8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | compliant | Infineon | |||||||||
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CY62167DV30LL-55ZXI
Infineon Technologies AG
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$16.1058 | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 55 ns | STANDARD SRAM | CONFIGURABLE AS 2M X 8 ALSO | 8 | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 30 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | INFINEON TECHNOLOGIES AG | 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48 | compliant | Infineon | |||||||
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CY62167DV30LL-55ZXI
Cypress Semiconductor
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$22.2781 | Yes | Yes | Transferred | 16.7772 Mbit | 16 | 1MX16 | 3 V | 55 ns | STANDARD SRAM | CONFIGURABLE AS 2M X 8 ALSO | 8 | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 30 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | CYPRESS SEMICONDUCTOR CORP | 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48 | compliant | TSOP1 | 48 | 3A991.B.2.A | 8542.32.00.41 | |||
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CY62167DV30LL-55ZXIT
Infineon Technologies AG
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$25.9197 | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 55 ns | STANDARD SRAM | CONFIGURABLE AS 2M X 8 ALSO | 8 | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 1.5 V | 30 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | INFINEON TECHNOLOGIES AG | 12 X 18.40 MM, 1 MM HEIGHT, LEAD FREE, MO-142, TSOP1-48 | compliant | Infineon | |||||||
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CY62167DV30LL-55ZIT
Rochester Electronics LLC
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Check for Price | Active | 16.7772 Mbit | 1MX16 | 3 V | 55 ns | STANDARD SRAM | CONFIGURABLE AS 2M X 8 ALSO | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | COMMERCIAL | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | ROCHESTER ELECTRONICS LLC | 12 X 18.40 MM, 1 MM HEIGHT, MO-142, TSOP1-48 | unknown | TSOP1 | 48 | ||||||||||||||||||
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CY62167DV30LL-70BVXI
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | STANDARD SRAM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PBGA-B48 | COMMERCIAL | e1 | NOT SPECIFIED | 85 °C | -40 °C | 260 | 20 | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 750 µm | BOTTOM | 1 mm | 9.5 mm | 8 mm | ROCHESTER ELECTRONICS LLC | 8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | unknown | BGA | 48 | |||||||||||||
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CY62167DV30L-70ZI
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | STANDARD SRAM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 µA | 1.5 V | 25 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | CYPRESS SEMICONDUCTOR CORP | 12 X 18.40 MM, 1 MM HEIGHT, TSOP1-48 | compliant | TSOP1 | 48 | 3A991.B.2.A | 8542.32.00.41 | |||||||
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CY62167DV30LL-45ZIT
Cypress Semiconductor
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Check for Price | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3 V | 45 ns | STANDARD SRAM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PDSO-G48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | CYPRESS SEMICONDUCTOR CORP | TSOP1, | unknown | TSOP1 | 48 | 3A991.B.2.A | 8542.32.00.41 |