Parametric results for: cs2410 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Pbfree Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 18 FREE WHEELING DIODE 1 STANDARD: UL 94V-0 24

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1.9 inch 78

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0.12 inch 39 0.165 inch 39

Min (inch) - Max (inch)

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1.9 inch 78

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19X19 78

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AU ON NI 12 GOLD OVER NICKEL 18 NOT SPECIFIED 2 SN-PB ON NI 10 TIN LEAD OVER NICKEL 20

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Gold (Au) - with Nickel (Ni) barrier 19 GOLD OVER NICKEL 19 TIN LEAD OVER NICKEL 17 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 23

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Contact Material (5)

BE-CU 22 BERYLLIUM COPPER 2 BERYLLIUM COPPER ALLOY 36 BRASS 1 NOT SPECIFIED 1

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RND PIN-SKT 78

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IC SOCKET 78

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PGA241 72 PGA361 6

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GLASS FILLED EPOXY 2 GLASS FILLED THERMOPLASTIC 20 POLYBUTYLENE TEREPHTHALATE 16 POLYPHENYLENE SULFIDE 16 THERMOPLASTIC POLYESTER 24

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e0 40 e4 38

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Manufacturer (2)

Advanced Interconnections Corp 78 Powerex Power Semiconductors 3

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0.1 inch 78

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STRAIGHT 78

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Number of Contacts (1)

241 78

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140.0 °C 22 150.0 °C 5 260.0 °C 18

Min (°C) - Max (°C)

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-60.0 °C 44 -40.0 °C 1

Min (°C) - Max (°C)

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RECTANGULAR 78

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100 µm 78

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Active 2 Obsolete 79

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No 1

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No 63

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Terminal Pitch (1)

2.54 mm 78

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SOLDER 78

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